SP4428 Datasheet, PDF (8/11 Pages) Sipex Corporation – Electroluminescent Lamp Driver High Drive Capability for Low Voltage Applications

BONDING DIAGRAM
HON
V_{DD EL1}
X
Y
C_OSC
EL2
CAP
V_SS COIL
PAD PIN X
HON 8 -822.5
V_DD
7
205.0
EL1 6 796.0
EL2 5 870.5
CAP 4 870.5
COIL 3 785.5
V_SS
2
175.5
C_OSC
1 -848.0
Y
393.5
418.5
349.5
19.5
-189.5
-389.5
-420.5
-106.0
NOTES:
1. Dimensions are in Microns unless otherwise noted.
2. Bonding pads are 125 X 125 typical.
3. Outside dimensions are maximum, including scribe area.
4. Die thickness is 380 ± 25 microns.
5. Pad center coordinates are relative to die center.
6. Die size (step size): 81 X 46 mils
Figure 5. Bonding Diagram
SP4428DS/16
SP4428 Electroluminescent Lamp Driver
8
© Copyright 2000 Sipex Corporation