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SP4302 Datasheet, PDF (5/10 Pages) SIPAT Co,Ltd – 50 Ω RF Digital Attenuator
SP4302
Product Specification
Figure 14. Pin Configuration (Top View)
C16 1
RF1 2
Data 3
Clock 4
LE 5
20-lead QFN
4x4mm
Exposed Solder Pad
15 C8
14 RF2
13 P/S
12 Vss/GND
11 GND
Table 3. Absolute Maximum Ratings
Symbol Parameter/Conditions Min Max Units
VDD
Power supply voltage
-0.3 4.0
V
VI
Voltage on any DC input
-0.3
VDD+
0.3
V
TST
Storage temperature range -65 150
°C
PIN
VESD
Input power (50Ω)
ESD voltage (Human Body
Model)
+30 dBm
500
V
Exceeding absolute maximum ratings may cause per-
manent damage. Operation should be restricted to the
limits in the Operating Ranges table. Operation be-
tween operating range maximum and absolute maxi-
mum for extended periods may reduce reliability.
Table 2. Pin Descriptions
Pin
Pin
No.
Name
Description
1
C16 Attenuation control bit, 16dB (Note 4).
2
RF1 RF port (Note 1).
3
Data Serial interface data input (Note 4).
4
Clock Serial interface clock input.
5
LE
Latch Enable input (Note 2).
6
VDD
Power supply pin.
7
PUP1 Power-up selection bit, MSB.
8
PUP2 Power-up selection bit, LSB.
9
VDD
Power supply pin.
10
GND Ground connection.
11
GND Ground connection.
12
Vss/GND
Negative supply voltage or GND
connection(Note 3)
13
P/S
Parallel/Serial mode select.
14
RF2 RF port (Note 1).
15
C8
Attenuation control bit, 8 dB.
16
C4
Attenuation control bit, 4 dB.
17
C2
Attenuation control bit, 2 dB.
18
GND Ground connection.
19
C1
Attenuation control bit, 1 dB.
20
Paddle
C0.5
GND
Attenuation control bit, 0.5 dB.
Ground for proper operation
Note 1: Both RF ports must be held at 0 VDC or DC blocked with an
external series capacitor.
2: Latch Enable (LE) has an internal 100 kΩresistor to VDD.
3: Connect pin 12 to GND to enable internal negative voltage
generator. Connect pin 12 to VSS (-VDD) to bypass and
disable internal negative voltage generator.
4. Place a 10 kΩresistor in series, as close to pin as possible to
avoid frequency resonance.
Table 4. Operating Ranges
Parameter
VDD Power Supply
Voltage
IDD Power Supply
Current
Digital Input High
Min Typ
2.7
3.0
0.7xVDD
Digital Input Low
Digital Input Leakage
Input Power
Temperature range
-40
Max
3.3
100
0.3xVDD
1
+24
85
Units
V
µA
V
V
µA
dBm
°C
Exposed Solder Pad Connection
The exposed solder pad on the bottom of the package
must be grounded for proper device operation.
Electrostatic Discharge (ESD) Precautions
When handling this CMOS device, observe the
same precautions that you would use with other ESD-
sensitive devices. Although this device contains
circuitry to protect it from damage due to ESD,
precautions should be taken to avoid exceeding the
rate specified in Table 3.
Latch-Up Avoidance
Unlike conventional CMOS devices, CMOS devices
are immune to latch-up.
Switching Frequency
The SP4302 has a maximum 25 kHz switching rate.
Resistor on Pin 1 & 3
A 10 kΩ resistor on the inputs to Pin 1 & 3 (see Figure
16) will eliminate package resonance between the RF
input pin and the two digital inputs. Specified
attenuation error versus frequency performance is
dependent upon this condition.
Tel: +86-23-62808818 Fax: +86-23-62805284 www.sipatsaw.com / sawmkt@sipat.com
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