SP43303 Datasheet, PDF (4/8 Pages) SIPAT Co,Ltd – 433.92MHz RF SAW Filter 1.7MHz Bandwidth

China Electronics Technology Group Corporation
No.26 Research Institute
SIPAT Co., Ltd.
www.sipatsaw.com
433.92MHz RF SAW Filter
1.7MHz Bandwidth
Part Number: SP43303
4. Reliability
4.1 Mechanical Shock: The components shall remain within the electrical specifications after
three one-half sine shock pulses(3000g’s for 0.3 ms) in each direction(for six total) along
each of the three mutually perpendicular axes for a total of 18 shocks.
4.2 Vibration Fatigue: The components shall remain within the electrical specifications after
loaded vibration at 20~55Hz, amplitude 1.5mm, X,Y,Z, direction, for 2 hours.
4.3 Leak Test
4.3.1 Gross Leak Test: Submerge samples into at +85℃ water for at least 1 minute. Carefully
observe the
samples. No bubbles should be seen.
4.3.2 Fine Leak Test: Expose samples for testing to 60 PSIG Helium gas for 2 hours. Then
transfer the same
samples to another chamber and draw a vacuum. Measure the leak rate. Failure is defined
if the leak rate
exceeds 5×10^-8 atm cc/sec Helium.
4.4 High Temperature Storage: The components shall remain within the electrical
specifications after being kept at the 85℃±2℃for 960 hours, then kept at room
temperature for 2 hours.
4.5 Low Temperature Storage: The components shall remain within the electrical specifications
after being kept at the –40℃±2℃for 960 hours, then kept at room temperature for 2 hours.
4.6 Temperature Cycle: The components shall remain within the electrical specification after
32 cycles of high and low temperature testing (one cycle: 80℃ for 30 minutes → 25℃ for
20 seconds → -40℃ for 30 minutes) than kept at room temperature for 2 hours.
4.7 Humidity Test: The components shall remain within the electrical specifications after being
kept at the condition of ambient temperature 70℃, and 90~95% RH for 240 hours, then
kept at room temperature and normal humidity for 4 hours.
4.8 Solder-heat Resistance: The components shall remain within the electrical specifications
after dipped in the solder at 260℃±5℃ for 10 to 11 seconds, then kept at room
temperature for 10 minutes.
4.9 Solderability: Solderability of terminal shall be kept at more than 80% after dipped in the
solder flux at 230℃±5℃ for 5±1 seconds.
4.10 Storage: The components shall meet the electrical and mechanical specifications after 5
years storage, if stored within the temperature range of -40℃~+85℃ and in the humidity of
20 to 60% r.h.
SIPAT Co., Ltd.
( CETC No. 26 Research Institute )
Nanping Huayuan Road No. 14
Chongqing, China, 400060
Part Number
Rev. Date
Rev.
SP43303
2006-7-19
1.0
Page 4/8
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Fax: [phone] www.sipatsaw.com / [e-mail]