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SSFK3208 Datasheet, PDF (1/7 Pages) Silikron Semiconductor Co.,LTD. – High Power and current handing capability | |||
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SSFK3208
DESCRIPTION
The SSFK3208 uses advanced trench
technology to provide excellent RDS(ON)
and low gate charge .This device is
suitable for use as a load switch or in
PWM applications.
GENERAL FEATURES
â VDS = 30V,ID =11A
RDS(ON) < 13m⦠@ VGS=4.5V
RDS(ON) < 9m⦠@ VGS=10V
â High Power and current handing capability
â Lead free product is acquired
â Surface Mount Package
D
G
S
Schematic diagram
Marking and pin Assignment
Application
âPWM applications
âLoad switch
âPower management
GEMPAK5060 top and bottom view
PACKAGE MARKING AND ORDERING INFORMATION
Device Marking
Device
Device Package
Reel Size
Tape width
Quantity
SSFK3208
SSFK3208
GEMPAK5060
-
-
-
ABSOLUTE MAXIMUM RATINGS(TA=25âunless otherwise noted)
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
ID(25â)
Drain Current-Continuous@ Current-Pulsed (Note 1)
ID(70â)
IDM
Maximum Power Dissipation
PD
Operating Junction and Storage Temperature Range
TJ,TSTG
Limit
30
±20
11
8.6
50
2
-55 To 150
Unit
V
V
A
A
A
W
â
THERMAL CHARACTERISTICS
Thermal Resistance,Junction-to-Ambient (Note 2)
RθJA
62.5
â/W
ELECTRICAL CHARACTERISTICS (TA=25âunless otherwise noted)
Parameter
Symbol
Condition
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
BVDSS
VGS=0V ID=250μA
Min Typ Max
30
Unit
V
©Silikron Semiconductor CO.,LTD.
1
http://www.silikron.com
v1.0
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