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SSFD6035 Datasheet, PDF (1/7 Pages) Silikron Semiconductor Co.,LTD. – High Power and current handing capability | |||
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SSFD6035
DESCRIPTION
The SSFD6035 uses advanced trench
technology to provide excellent RDS(ON)
and low gate charge .This device is
suitable for use as a load switch or in
PWM applications.
GENERAL FEATURES
â VDS =- 60V,ID =-26A
RDS(ON) < 40m⦠@ VGS=-10V
RDS(ON) < 55m⦠@ VGS=-4.5V
â High Power and current handing capability
â Lead free product is acquired
â Surface Mount Package
D
G
S
Schematic diagram
Marking and pin Assignment
Application
âPWM applications
âLoad switch
âPower management
PACKAGE MARKING AND ORDERING INFORMATION
Device Marking
Device
Device Package
Reel Size
SSFD6035
SSFD6035
DPAK
-
Tape width
-
Quantity
-
ABSOLUTE MAXIMUM RATINGS(TA=25âunless otherwise noted)
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
ID(25â)
Drain Current-Continuous@ Current-Pulsed (Note 1)
ID(70â)
IDM
Maximum Power Dissipation
PD
Operating Junction and Storage Temperature Range
TJ,TSTG
Limit
-60
±20
-26
-20
-60
60
-55 To 175
Unit
V
V
A
A
A
W
â
THERMAL CHARACTERISTICS
Thermal Resistance,Junction-to-Ambient (Note 2)
RθJA
25
â/W
ELECTRICAL CHARACTERISTICS (TA=25âunless otherwise noted)
Parameter
Symbol
Condition
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
BVDSS
VGS=0V ID=-250μA
Min Typ Max Unit
-60
V
©Silikron Semiconductor CO.,LTD.
1
http://www.silikron.com
v2.0
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