|
SSF6816 Datasheet, PDF (1/5 Pages) Silikron Semiconductor Co.,LTD. – High Power and current handing capability | |||
|
SSF6816
DESCRIPTION
The SSF6816 uses advanced trench technology to
provide excellent RDS(ON), low gate charge and
operation with gate voltages as low as 2.5V while
retaining a 12V VGS(MAX) rating. It is ESD protected.
This device is suitable for use as a uni-directional
or bi-directional load switch, facilitated by its
common-drain configuration.
GENERAL FEATURES
â VDS = 30V,ID = 8A
RDS(ON) < 30m⦠@ VGS=2.5V
RDS(ON) < 24m⦠@ VGS=3.1V
RDS(ON) < 22m⦠@ VGS=4.0V
RDS(ON) < 20m⦠@ VGS=4.5V
RDS(ON) < 17m⦠@ VGS=10V
ESD Ratingï¼2000V HBM
â High Power and current handing capability
â Lead free product is acquired
â Surface Mount Package
Schematic diagram
Marking and pin Assignment
DFN2Ã5-6L top view
PACKAGE MARKING AND ORDERING INFORMATION
Device Marking
Device
Device Package
Reel Size
6816
SSF6816
DFN2Ã5-6L
Tape width
Quantity
3000 units
ABSOLUTE MAXIMUM RATINGS(TA=25âunless otherwise noted)
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
ID
Drain Current-Continuous@ Current-Pulsed (Note 1)
IDM
Maximum Power Dissipation
PD
Operating Junction and Storage Temperature Range
TJ,TSTG
Limit
30
±12
8
45
1.7
-55 To 150
Unit
V
V
A
A
W
â
THERMAL CHARACTERISTICS
Thermal Resistance,Junction-to-Ambient (Note 2)
RθJA
40
â /W
ELECTRICAL CHARACTERISTICS (TA=25âunless otherwise noted)
Parameter
Symbol
Condition
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
BVDSS
VGS=0V ID=250μA
Zero Gate Voltage Drain Current
IDSS
VDS=30V,VGS=0V
Min Typ Max Unit
30
V
1
μA
©Silikron Semiconductor CO.,LTD.
1
http://www.silikron.com
v1.0
|
▷ |