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SSF6010 Datasheet, PDF (1/5 Pages) Silikron Semiconductor Co.,LTD. – Power switching application | |||
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SSF6010
Feathers:
 Advanced trench process technology
 avalanche energy, 100% test
ID =60A
BV=60V
Rdson=10mohm
 Fully characterized avalanche voltage and current
Description:
The SSF6010 is a new generation of middle voltage and high
current NâChannel enhancement mode trench power
MOSFET. This new technology increases the device reliability
SSF6010 TOP View (TO220)
and electrical parameter repeatability. SSF6010 is assembled
in high reliability and qualified assembly house.
Application:
 Power switching application
Absolute Maximum Ratings
Parameter
Max.
Units
ID@Tc=25 ÙC Continuous drain current,VGS@10V
60
ID@Tc=100ÙC Continuous drain current,VGS@10V
45
A
IDM
Pulsed drain current â
240
PD@TC=25ÙC
Power dissipation
100
W
Linear derating factor
0.74
W/ ÙC
VGS
Gate-to-Source voltage
±20
V
EAS
Single pulse avalanche energy â¡
220
mJ
EAR
Repetitive avalanche energy
TBD
TJ
Operating Junction and
â55 to +150
ÙC
TSTG
Storage Temperature Range
Thermal Resistance
Parameter
Min.
Typ.
Max.
Units
RθJC
Junction-to-case
RθJA
Junction-to-ambient
â
1.25
â
â
â
62
ÙC/W
Electrical Characteristics @TJ=25 ÙC(unless otherwise specified)
Parameter
Min. Typ. Max. Units
Test Conditions
BVDSS Drain-to-Source breakdown voltage 60
RDS(on) Static Drain-to-Source on-resistance â
VGS(th)
Gate threshold voltage
2.0
gfs
Forward transconductance
-
â
IDSS
Drain-to-Source leakage current
â
Gate-to-Source forward leakage
â
IGSS Gate-to-Source reverse leakage
â
ââ V
VGS=0V,ID=250μA
9 10 mâ¦
VGS=10V,ID=30A
4.0 V
VDS=VGS,ID=250μA
58 â S
VDS=5V,ID=30A
â2
VDS=60V,VGS=0V
μA
â 10
VDS=60V,
VGS=0V,TJ=150ÙC
â 100 nA VGS=20V
â -100
VGS=-20V
©Silikron Semiconductor CO.,LTD.
2009.12.15
Version : 1.0
page 1of5
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