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SSF4N60 Datasheet, PDF (1/6 Pages) Silikron Semiconductor Co.,LTD. – Extremely high dv/dt capability | |||
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SSF4N60
Features
â Extremely high dv/dt capability
â Low Gate Charge Qg results in Simple Drive Requirement
ï® 100% avalanche tested
ï® Gate charge minimized
ï® Very low intrinsic capacitances
ï® Very good manufacturing repeatability
Vdss = 600V
Id = 4A
Rdson = 2.3Ω (typ.)
Description
The SSF4N60 is a new generation of high voltage NâChannel
enhancement mode power MOSFETs and is obtained through
an extreme optimization layout design, in additional to pushing
on-resistance significantly down, special care is taken to ensure
a very good dv/dt capability, provide superior switching
performance, withstand high energy pulse in the avalanche, and
increases packing density.
Application
â High current, high speed switching
â Lighting
â Ideal for off-line power supply, adaptor, PFC
SSF4N60 TOP View (TO220)
Absolute Maximum Ratings
Parameter
ID@Tc=25 ÙC Continuous Drain Current,VGS@10V
ID@Tc=100ÙC Continuous Drain Current,VGS@10V
IDM
Pulsed Drain Current â
PD@TC=25ÙC
Power Dissipation
Linear Derating Factor
VGS
Gate-to-Source Voltage
EAS
Single Pulse Avalanche Energy â¡
IAR
Avalanche Current â
EAR
Repetitive Avalanche Energy â
dv/dt
Peak Diode Recovery dv/dt â¢
TJ
Operating Junction and
TSTG
Storage Temperature Range
Max.
4
2.2
16
80
0.67
±30
90
4
8.5
4.5
â55 to +150
Units
A
W
W/ CÙ
V
mJ
A
mJ
V/ns
ÙC
Thermal Resistance
Parameter
Min.
RθJC
Junction-to-case
â
RθCS
Case-to-Sink, Flat, Greased Surface
â
RθJA
Junction-to-Ambient
â
Typ.
â
0.50
â
Max.
1.56
â
62.5
Units
ÙC/W
©Silikron Semiconductor Corporation
2009.11.10
Version: 1.0
page 1of6
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