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SSF4624 Datasheet, PDF (1/5 Pages) Silikron Semiconductor Co.,LTD. – High Power and current handing capability | |||
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SSF4624
DESCRIPTION
The SSF4624 uses advanced trench
technology to provide excellent RDS(ON)
and low gate charge .This device is
suitable for use as a load switch or in
PWM applications.
GENERAL FEATURES
â VDS = 40V,ID =6A
RDS(ON) < 45m⦠@ VGS=4.5V
RDS(ON) < 31m⦠@ VGS=10V
â High Power and current handing capability
â Lead free product is acquired
â Surface Mount Package
Schematic diagram
Marking and pin Assignment
Application
âPWM applications
âLoad switch
âPower management
PACKAGE MARKING AND ORDERING INFORMATION
Device Marking
Device
Device Package
Reel Size
SSF4624
SSF4624
SOP-8
Ã330mm
SOP-8 top view
Tape width
12mm
Quantity
3000 units
ABSOLUTE MAXIMUM RATINGS(TA=25âunless otherwise noted)
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
Drain Current-Continuous@ Current-Pulsed (Note 1)
IDï¼25âï¼
IDï¼70âï¼
IDM
Maximum Power Dissipation
PD
Operating Junction and Storage Temperature Range
TJ,TSTG
Limit
40
±20
6
5
20
2
-55 To 150
Unit
V
V
A
A
A
W
â
THERMAL CHARACTERISTICS
Thermal Resistance,Junction-to-Ambient (Note 2)
RθJA
62.5
â/W
ELECTRICAL CHARACTERISTICS (TA=25âunless otherwise noted)
Parameter
Symbol
Condition
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
BVDSS
IDSS
VGS=0V ID=250μA
VDS=32V,VGS=0V
Min Typ Max
40
1
Unit
V
μA
©Silikron Semiconductor CO.,LTD.
1
http://www.silikron.com
v1.0
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