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SSF4606 Datasheet, PDF (1/5 Pages) Silikron Semiconductor Co.,LTD. – High Power and current handing capability | |||
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DESCRIPTION
The SSF4606 uses advanced trench
technology MOSFET to provide excellent
RDS(ON) and low gate charge. The
complementary MOSFET may be used
in power inverters, and other applications.
GENERAL FEATURES
âN-Channel
VDS = 30V,ID = 6.9A
RDS(ON) < 42m⦠@ VGS=4.5V
RDS(ON) < 28m⦠@ VGS=10V
âP-Channel
VDS = -30V,ID = -6A
RDS(ON) < 58m⦠@ VGS=-4.5V
RDS(ON) < 35m⦠@ VGS=-10V
âHigh Power and current handing capability
âLead free product is acquired
âSurface Mount Package
SSF4606
N-channel P-channel
Schematic diagram
Marking and pin Assignment
PACKAGE MARKING AND ORDERING INFORMATION
Device Marking
Device
Device Package Reel Size
4606
SSF4606
SOP-8
Ã330mm
SOP-8 top view
Tape width
12mm
Quantity
3000 units
ABSOLUTE MAXIMUM RATINGS(TA=25âunless otherwise noted)
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
TA=25â
Continuous Drain Current
ID
TA=70â
Pulsed Drain Current (Note 1)
IDM
TA=25â
Maximum Power Dissipation
PD
TA=70â
Operating Junction and Storage Temperature Range
TJ,TSTG
N-Channel
30
±20
6.9
6.0
30
2.0
1.44
-55 To 150
P-Channel
-30
±20
-6
-5.0
-30
2.0
1.44
-55 To 150
Unit
V
V
A
A
W
â
THERMAL CHARACTERISTICS
Thermal Resistance,Junction-to-Ambient (Note2)
N-Ch
62.5
RθJA
â/W
P-Ch
62.5
ELECTRICAL CHARACTERISTICS (TA=25âunless otherwise noted)
Parameter
Symbol
Condition
OFF CHARACTERISTICS
Min Typ Max Unit
©Silikron Semiconductor CO.,LTD.
1
http://www.silikron.com
v1.0
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