English
Language : 

SSF4414 Datasheet, PDF (1/5 Pages) Silikron Semiconductor Co.,LTD. – PWM applications
SSF4414
DESCRIPTION
The SSF4414 uses advanced trench
technology to provide excellent RDS(ON)
and low gate charge .This device is
suitable for use as a load switch or in
PWM applications.
GENERAL FEATURES
● VDS = 30V,ID = 8.5A
RDS(ON) < 40mΩ @ VGS=4.5V
RDS(ON) < 26mΩ @ VGS=10V
● High Power and current handing capability
● Lead free product is acquired
● Surface Mount Package
Application
●PWM applications
●Load switch
●Power management
D
G
S
Schematic diagram
D DD D
8 7 65
4414
1 2 34
S SSG
Marking and pin Assignment
SOP-8 top view
PACKAGE MARKING AND ORDERING INFORMATION
Device Marking
Device
Device Package
Reel Size
4414
SSF4414
SOP-8
Ø330mm
Tape width
12mm
Quantity
3000 units
ABSOLUTE MAXIMUM RATINGS(TA=25℃unless otherwise noted)
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
ID
Drain Current-Continuous@ Current-Pulsed (Note 1)
IDM
Maximum Power Dissipation
PD
Operating Junction and Storage Temperature Range
TJ,TSTG
Limit
30
±20
8.5
50
3
-55 To 150
Unit
V
V
A
A
W
℃
THERMAL CHARACTERISTICS
Thermal Resistance,Junction-to-Ambient (Note 2)
RθJA
40
℃ /W
ELECTRICAL CHARACTERISTICS (TA=25℃unless otherwise noted)
Parameter
Symbol
Condition
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
BVDSS
VGS=0V ID=250μA
Zero Gate Voltage Drain Current
IDSS
VDS=24V,VGS=0V
Gate-Body Leakage Current
IGSS
VGS=±20V,VDS=0V
ON CHARACTERISTICS (Note 3)
Min Typ Max
30
1
±100
Unit
V
μA
nA
©Silikron Semiconductor CO.,LTD.
1
http://www.silikron.com
v1.1