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SSF2841 Datasheet, PDF (1/5 Pages) Silikron Semiconductor Co.,LTD. – High Power and current handing capability | |||
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SSF2841
DESCRIPTION
The SSF2841 uses advanced trench technology to
provide excellent RDS(ON), low gate charge and operation
with gate voltages as low as -0.7V. This device is suitable
for use as a load switch or in PWM applications.
GENERAL FEATURES
â VDS = -20V,ID = -5A
RDS(ON) <72m⦠@ VGS=-2.5V
RDS(ON) < 50m⦠@ VGS=-4.5V
â High Power and current handing capability
â Lead free product is acquired
â Surface Mount Package
Schematic diagram
D1
D2
S1
S1
S8S2F02854A1
S2
S2
G1
G2
Application
âPWM applications
âLoad switch
âPower management
Pin Assignment
PACKAGE MARKING AND ORDERING INFORMATION
Device Marking
Device
Device Package
Reel Size
SSF2841
SSF2841
TSSOP-8
ï¼
TSSOP-8 top view
Tape width
ï¼
Quantity
ï¼
ABSOLUTE MAXIMUM RATINGS(TA=25âunless otherwise noted)
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
ID
Drain Current-Continuous@ Current-Pulsed (Note 1)
IDM
Maximum Power Dissipation
PD
Operating Junction and Storage Temperature Range
TJ,TSTG
Limit
-20
±12
-5
-20
3.2
-55 To 150
Unit
V
V
A
A
W
â
THERMAL CHARACTERISTICS
Thermal Resistance,Junction-to-Ambient (Note 2)
RθJA
83
â /W
ELECTRICAL CHARACTERISTICS (TA=25âunless otherwise noted)
Parameter
Symbol
Condition
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
BVDSS
VGS=0V ID=-250μA
Zero Gate Voltage Drain Current
IDSS
VDS=-20V,VGS=0V
Gate-Body Leakage Current
IGSS
VGS=±12V,VDS=0V
Min Typ Max Unit
-20
V
-1
μA
±100
nA
©Silikron Semiconductor CO.,LTD.
1
http://www.silikron.com
v1.1
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