SI535 Datasheet, PDF (5/12 Pages) Silicon image – ULTRA LOW JITTER CRYSTAL OSCILLATOR (XO)

Si535/536
Table 6. Environmental Compliance
The Si535/536 meets the following qualification test requirements.
Parameter
Mechanical Shock
Mechanical Vibration
Solderability
Gross & Fine Leak
Resistance to Solder Heat
Moisture Sensitivity Level
Contact Pads
Conditions/Test Method
MIL-STD-883, Method 2002
MIL-STD-883, Method 2007
MIL-STD-883, Method 2003
MIL-STD-883, Method 1014
MIL-STD-883, Method 2036
J-STD-020, MSL1
Gold over Nickel
Table 7. Thermal Characteristics
(Typical values TA = 25 ºC, V_DD = 3.3 V)
Parameter
Symbol Test Condition Min
Typ
Max Unit
Thermal Resistance Junction to Ambient
_JA
Thermal Resistance Junction to Case
_JC
Ambient Temperature
T_A
Junction Temperature
T_J
Still Air
Still Air
—
84.6
— °C/W
—
38.8
— °C/W
–40
—
85
°C
—
—
125
°C
Table 8. Absolute Maximum Ratings¹
Parameter
Symbol
Rating
Unit
Maximum Operating Temperature
T_AMAX
85
°C
Supply Voltage, 2.5/3.3 V Option
V_DD
–0.5 to +3.8
V
Input Voltage (any input pin)
V_I
–0.5 to V_DD + 0.3
V
Storage Temperature
T_S
–55 to +125
°C
ESD Sensitivity (HBM, per JESD22-A114)
ESD
2500
V
Soldering Temperature (Pb-free profile)²
Soldering Temperature Time @ T_PEAK (Pb-free profile)²
T_PEAK
t_P
260
20–40
°C
seconds
Notes:
1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional
operation or specification compliance is not implied at these conditions. Exposure to maximum rating conditions for
extended periods may affect device reliability.
2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download at
www.silabs.com/VCXO for further information, including soldering profiles.
Preliminary Rev. 0.6
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