SI7023-A10 Datasheet, PDF (8/25 Pages) Silicon Laboratories – Excellent long term stability

Si7023-A10
Table 6. Thermal Characteristics
Parameter
Junction to Air Thermal Resistance
Junction to Air Thermal Resistance
Junction to Air Thermal Resistance
Junction to Case Thermal Resistance
Junction to Board Thermal Resistance
Symbol
_JA
_JA
_JA
_JC
_JB
Test Condition
JEDEC 2-Layer board,
No Airflow
JEDEC 2-Layer board,
1 m/s Airflow
JEDEC 2-Layer board,
2.5 m/s Airflow
JEDEC 2-Layer board
JEDEC 2-Layer board
DFN-6
256
224
205
22
134
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
Table 7. Absolute Maximum Ratings¹
Parameter
Symbol
Test Condition
Min Typ
Max
Unit
Ambient temperature
under bias
Storage Temperature²
–55 —
125
°C
–65 —
150
°C
Voltage on I/O pins
–0.3 — VDD+0.3V V
Voltage on VDD with
respect to GND
ESD Tolerance
HBM
–0.3 —
4.2
V
—
—
2
kV
CDM
—
—
1.25
kV
MM
—
—
250
V
Notes:
1. Absolute maximum ratings are stress ratings only, operation at or beyond these conditions is not implied and may
shorten the life of the device or alter its performance.
2. Special handling considerations apply; see application note, “AN607: Si70xx Humidity Sensor Designer’s Guide”.
8
Rev. 1.1