SI7022-A10 Datasheet, PDF (8/25 Pages) Silicon Laboratories – Optional factory-installed cover

Si7022-A10
Table 6. Thermal Characteristics
Parameter
Junction to Air Thermal Resistance
Junction to Air Thermal Resistance
Junction to Air Thermal Resistance
Junction to Case Thermal Resistance
Junction to Board Thermal Resistance
Symbol
_JA
_JA
_JA
_JC
_JB
Test Condition
JEDEC 2-Layer board,
No Airflow
JEDEC 2-Layer board,
1 m/s Airflow
JEDEC 2-Layer board,
2.5 m/s Airflow
JEDEC 2-Layer board
JEDEC 2-Layer board
DFN-6
256
224
205
22
134
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
Table 7. Absolute Maximum Ratings¹
Parameter
Ambient temperature
under bias
Storage Temperature²
Voltage on I/O pins
Voltage on VDD with
respect to GND
ESD Tolerance
Symbol
Test Condition
HBM
CDM
MM
Min Typ
Max
Unit
–55
—
125
°C
–65
—
150
°C
–0.3 — VDD+0.3V V
–0.3 —
4.2
V
—
—
2
kV
—
—
1.25
kV
—
—
250
V
Notes:
1. Absolute maximum ratings are stress ratings only, operation at or beyond these conditions is not implied and may
shorten the life of the device or alter its performance.
2. Special handling considerations apply; see application note, “AN607: Si70xx Humidity Sensor Designer’s Guide”.
8
Rev. 1.1