EFM32ZG222 Datasheet, PDF (56/70 Pages) Silicon image – Energy, gas, water and smart metering

...the world's most energy friendly microcontrollers
5. Dimensions S and V to be determined at seating plane AC.
6. Dimensions A and B do not include mold protrusion. Allowable protrusion is 0.250 per side. Dimen-
sions A and B do include mold mismatch and are determined at datum AB.
7. Dimension D does not include dambar protrusion. Dambar protrusion shall not cause the D dimension
to exceed 0.350.
8. Minimum solder plate thickness shall be 0.0076.
9. Exact shape of each corner is optional.
Table 4.4. QFP48 (Dimensions in mm)
DIM
MIN
NOM
MAX
DIM
MIN
NOM
MAX
A
-
7.000 BSC
-
M
-
12DEG REF
-
A1
-
3.500 BSC
-
N
0.090
-
0.160
B
-
7.000 BSC
-
P
-
0.250 BSC
-
B1
-
3.500 BSC
-
R
0.150
-
0.250
C
1.000
-
1.200
S
-
9.000 BSC
-
D
0.170
-
0.270
S1
-
4.500 BSC
-
E
0.950
-
1.050
V
-
9.000 BSC
-
F
0.170
-
0.230
V1
-
4.500 BSC
-
G
-
0.500 BSC
-
W
-
0.200 BSC
-
H
0.050
-
0.150
AA
-
1.000 BSC
-
J
0.090
-
0.200
K
0.500
-
0.700
L
0DEG
-
7DEG
The TQFP48 Package is 7 by 7 mm in size and has a 0.5 mm pin pitch.
The TQFP48 Package uses Nickel-Palladium-Gold preplated leadframe.
All EFM32 packages are RoHS compliant and free of Bromine (Br) and Antimony (Sb).
For additional Quality and Environmental information, please see:
http://www.silabs.com/support/quality/pages/default.aspx
2015-03-06 - EFM32ZG222FXX - d0066_Rev1.10
56
www.silabs.com