EFM32WG900 Datasheet, PDF (4/27 Pages) Silicon Laboratories – DSP instruction support and floating-point unit

3 Pinout and Package
...the world's most energy friendly microcontrollers
Note
Please refer to the application note "AN0002 EFM32 Hardware Design Considerations" for
guidelines on designing Printed Circuit Boards (PCB's) for the EFM32WG900.
3.1 Padout
The EFM32WG900 padout is shown in Figure 3.1 (p. 4) and Table 3.1 (p. 5). Alternate locations
are denoted by "#" followed by the location number (Multiple locations on the same pad are split with "/").
Alternate locations can be configured in the LOCATION bitfield in the *_ROUTE register in the module
in question.
Figure 3.1. EFM32WG900 Padout (top view, not to scale)
(X,Y): (- 2115, 2115)
PA0 1
PA1 2
PA2 3
PA3 4
PA4 5
PA5 6
PA6 7
iovdd_0 8
iovss_0 9
PD14 10
PD15 11
PB0 12
PB1 13
PB2 14
NC 15
PB3 16
PB4 17
PB5 18
PB6 19
iovss_1 20
iovdd_1 21
PC0 22
PC1 23
PC2 24
PC3 25
PC4 26
PC5 27
PB7 28
PB8 29
(X,Y): (- 2115, - 2115)
(X,Y): (0, 0)
(X,Y): (2115, 2115)
95 PF11
94 PC15
93 PF10
92 PC14
91 usb_vrego_1
90 usb_vrego_0
89 usb_vregi_1
88 usb_vregi_0
87 PC13
86 PC12
85 PC11
84 PC10
83 PC9
82 PC8
81 PE7
80 PE6
79 PE5
78 PE4
77 PE3
76 PE2
75 PE1
74 PE0
73 iovss_4
72 NC
71 dec_2
70 dec_1
69 dec_0
68 iovdd_4
67 vdd_dreg
66 vss_dreg
65 PC7
64 PC6
63 PD8
62 PD7
61 PD6
60 PD5
(X,Y): (2115, - 2115)
The pad coordinates represent the center of the pad opening relative to the die center.
2015-03-16 - EFM32WG900FXX - d0325_Rev1.20
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