SI863X Datasheet, PDF (33/36 Pages) Silicon Laboratories – Industrial automation systems

12. Document Change List
Revision 0.1
September 15, 2010
• Initial release.
Revision 0.1 to Revision 0.2
March 31, 2011
• Added chip graphics on page 1.
• Moved Tables 1 and 11 to page 20.
• Updated Table 6, “Insulation and Safety-Related Specifications,” on page 17.
• Updated Table 8, “IEC 60747-5-5 Insulation Characteristics for Si86xxxx*,” on page 18.
• Moved Table 1 to page 4.
• Moved Table 2 to page 5.
• Moved “Typical Performance Characteristics” to page 8.
• Updated "3. Pin Descriptions" on page 9.
• Updated "4. Ordering Guide" on page 10.
• Removed references to QSOP-16 package.
Revision 0.2 to Revision 1.0
July 14, 2011
• Reordered spec tables to conform to new convention.
• Removed “pending” throughout document.
Revision 1.0 to Revision 1.1
September 14, 2011
• Updated High Level Output Voltage VOH to 3.1 V in Table 3, “Electrical Characteristics,” on page 9.
• Updated High Level Output Voltage VOH to 2.3 V in Table 4, “Electrical Characteristics,” on page 12.
Revision 1.1 to Revision 1.2
March 21, 2012
• Updated "4. Ordering Guide" on page 10 to include MSL2A.
Revision 1.2 to Revision 1.3
June 26, 2012
• Updated Table 11 on page 20.
• Added junction temperature spec.
• Updated "2.3.1. Supply Bypass" on page 7.
• Removed “3.3.2. Pin Connections” on page 23.
• Updated "3. Pin Descriptions" on page 9.
• Updated table notes.
• Updated "4. Ordering Guide" on page 10.
• Removed Rev A devices.
• Updated "6. Land Pattern: 16-Pin Wide-Body SOIC" on page 13.
• Updated Top Marks.
• Added revision description.
Revision 1.3 to Revision 1.4
September 25, 2013
• Added Figure 3, “Common-Mode Transient Immunity Test Circuit,” on page 8.
• Added references to CQC throughout.
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Si8630/31/35 Data Sheet
Document Change List
Rev. 1.8 | 32