SI4684-A10 Datasheet, PDF (2/3 Pages) Silicon Laboratories – Single-Chip, FM/DAB/DAB Radio Receiver

Si4684-A10
Single-Chip, FM/DAB/DAB+ Radio Receiver
Selected Electrical Specifications
Parameter
Ambient Temperature
Analog Supply Voltage
Interface Supply Voltage
Core Digital Supply Voltage
Memory Supply Voltage
Analog FM
Input Frequency
Seek Time
DAB/DAB+
Input Frequency
Enable Acquisition Time
Symbol
T_A
V_A
V_IO
V_CORE
V_MEM
F_rf
F_rf
Test Conditions
Min
Typ
Max
Units
–40
25
85
°C
1.71
1.8
2.0
V
1.62
1.8
3.6
V
1.62
1.8
2.0
V
1.62
1.8
2.0
V
76
—
108
MHz
—
—
60
ms/ch
168
—
240
MHz
—
—
940
ms
Si4684-A10-GM (QFN)
Si4684-A10-GD (WLCSP)
Dimension
Min
Nom
Max
A
0.80
0.85
0.90
A1
0.00
0.02
0.05
b
0.18
0.25
0.30
D
7.00 BSC
D2
5.20
5.30
5.40
e
0.50 BSC
E
7.00 BSC
E2
5.20
5.30
5.40
L
0.30
0.40
0.50
aaa
0.15
bbb
0.10
ddd
0.05
eee
0.08
Notes:
1.
2.
3.
4.
All dimensions are shown in millimeters (mm) unless otherwise
noted.
Dimensioning and tolerancing per ASME Y14.5M-1994.
This drawing conforms to JEDEC Outline MO-220, Variation
VKKD-4.
Recommended card reflow profile is per the JEDEC/IPC J-
STD-020 specification for Small Body Components.
Dimension
Min
Nom
Max
A
0.55
0.59
0.63
A1
0.18
0.20
0.22
b
0.22
0.27
0.32
D
3.20 BSC.
E
3.77 BSC.
d
0.40 BSC.
e
0.40 BSC.
D1
2.40 BSC.
E1
3.20 BSC.
aaa
0.10
bbb
0.10
ccc
0.03
ddd
0.15
eee
0.05
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise
noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. Primary datum "C" and seating plane are defined by the spherical
crowns of the solder balls.
4. Dimension "b" is measured at the maximum solder bump diameter,
parallel to primary datum "C".
5. Recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for Small Body Components.
Digital Radio Receiver
Copyright © 2013 by Silicon Laboratories
05.07.2013
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