EFM32LG900 Datasheet, PDF (18/27 Pages) Silicon Laboratories – Memory Protection Unit

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3.5 Wafer Description
Table 3.4. Wafer and Die Information
Parameter
Value
Device Family
EFM32LG (Leopard Gecko)
Wafer Diameter
8 in
Die Dimensions (Outer edge of seal ring)
4230 µm × 4230 µm
Wafer Thickness (No backgrind)
725 µm ±15 µm
(28.54 mil ±1 mil)
Wafer Identification
Notch
Scribe Street Width
Die Per Wafer ¹
80 µm × 160 µm
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Passivation
Standard
Wafer Packaging Detail
Wafer Jar
Bond Pad Dimensions
65 µm (parallel to die edge) × 66 µm
Bond Pad Pitch Minimum
76 µm
Maximum Processing Temperature
250°C
Electronic Die Map Format
.txt
1_{Note: This is the Expected Known Good Die yielded per wafer and represents the batch order quantity (one wafer).}
3.5.1 Environmental
Bare silicon die are susceptible to mechanical damage and may be sensitive to light. When bare die
must be used in an environment exposed to light, it may be necessary to cover the top and sides with
an opaque material.
For additional Quality and Environmental information, please see:
http://www.silabs.com/support/quality/pages/default.aspx.
3.6 Wafer Storage Guidelines
It is necessary to conform to appropriate wafer storage practices to avoid product degradation or con-
tamination.
• Wafers may be stored for up to 18 months in the original packaging supplied by Silicon Labs.
• Wafers must be stored at a temperature of 18 - 24 °C.
• Wafers must be stored in a humidity-controlled environment with a relative humidity of <30%
• Wafers should be stored in a clean, dry, inert atmosphere (e.g. nitrogen or clean, dry air).
3.7 Failure Analysis (FA) Guidelines
Certain conditions must be met for Silicon Laboratories to perform Failure Analysis on devices sold in
wafer form.
• In order to conduct failure analysis on a device in a customer-provided package, Silicon Laboratories
must be provided with die assembled in an industry standard package that is pin compatible with
existing packages Silicon Laboratories offers for the device. Initial response time for FA requests that
meet these requirements will follow the standard FA guidelines for packaged parts.
2015-03-16 - EFM32LG900FXX - d0328_Rev1.20
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