SI3050-KT Datasheet, PDF (104/112 Pages) Silicon Laboratories – GLOBAL VOICE DAA

Si3050 + Si3018/19
Table 26. 20-Pin TSSOP Package Diagram Dimensions
Dimension
Min
Nom
Max
A
—
—
1.20
A1
0.05
—
0.15
A2
0.80
1.00
1.05
b
0.19
—
0.30
c
0.09
—
0.20
D
6.40
6.50
6.60
E
6.40 BSC
E1
4.40
4.40
4.50
e
0.65 BSC
L
0.45
0.60
0.75
L2
0.25 BSC
θ
0°
—
8°
aaa
0.10
bbb
0.10
ccc
0.20
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-153, Variation AC.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C
specification for Small Body Components.
104
Rev. 1.31