TS3300 Datasheet, PDF (1/12 Pages) Touchstone Semiconductor Inc – 0.6-4.5VIN, 1.8-5.25VOUT, 3.5-uA, Low Input Voltage, High-Efficiency Boost + LDO

TS3300
0.6-3V_IN, 1.8-3.6V_OUT, 3.5µA, High-Efficiency Boost + Output Load Switch
FEATURES
 Combines Low-power Boost + Output Load
Switch
 Boost Regulator
 Input Voltage: 0.6V- 3V
 Output Voltage: 1.8V- 3.6V
 Efficiency: Up to 84%
 No-load Input Current: 3.5µA
 Delivers >100mA at 1.8VBO from 1.2VBI
 Boost Shutdown Control
 No External Schottky Diode Required
 Anti-Crush Capability
 Prevents Input Voltage Collapse when
powered with Weak/High Impedance Power
Sources
 Single-Inductor, Discontinuous Conduction
Mode Scheme with Automatic Peak Current
Adjustment
 16-Pin, Low-Profile, Thermally-Enhanced
3mm x 3mm TQFN Package
APPLICATIONS
Coin Cell-Powered Portable Equipment
Single Cell Li-ion or Alkaline Powered Equipment
Solar or Mechanical Energy Harvesting
Wireless Microphones
Wireless Remote Sensors
RFID Tags
Blood Glucose Meters
Personal Health-Monitoring Devices
DESCRIPTION
The TS3300 is a 1st-generation power management
product that combines a high-efficiency boost
regulator and an output load switch in one package.
The boost regulator operates from a supply voltage
as low as 0.6V and can deliver at least 75mA at
1.2VBI to 3VBO, an industry first.
The TS3300 includes an anti-crush^TM feature to
prevent the collapse of the input voltage to the boost
regulator when the input is a weak (high impedance)
source. If the input voltage drops below a determined
voltage threshold (settable by a resistor divider), the
boost regulator switching cycles are paused,
effectively limiting the minimum input voltage. Anti-
crush^TM is useful in applications where a buffer
capacitor at the boost’s output can service burst
loads, and the input source exhibits substantial
source impedance (such as an old battery, or at cold
temperatures).
The TS3300 is fully specified over the -40°C to +85°C
temperature range and is available in a low-profile,
thermally-enhanced 16-pin 3x3mm TQFN package
with an exposed back-side paddle. For best
performance, solder the exposed back-side paddle to
PCB ground.
TYPICAL APPLICATION CIRCUIT
Efficiency vs Output Load Current
100
90 ^1.2VBI ^{to 1.8V}BO
80
70
60
50 ^{1.2VBI to 3VBO}
40
30
20
10 _{L: LPS4018-103ML}
0
0.01 0.1
1
10
100
I_BO - mA
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