1201243 Datasheet, PDF (1/2 Pages) Silicon Laboratories – Silicon Laboratories is pleased to announce revision 1.1 of the datasheet

Process Change Notice #1201243
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PCN Date: 24Jan12
Effective Date: 24Jan12
Title: Si32260-61 datasheet revision 1.1
Originator: Rick Bye
Phone: [phone] Dept: Wireline Access
Customer Contact: Kathy Haggar Phone: [phone] Dept: Inside Sales
PCN Type:
Assembly
Datasheet
Packing
Last Order Date: N/A
Discontinuance
Fabrication
Labeling
Package
Product Revision
Location
Test
Other
PCN Details
Description of Change: Silicon Laboratories is pleased to announce revision 1.1 of the datasheet for
the Si32260 and Si32261 single package dual ProSLICs. This revision adds information on the newly
qualified LGA package option. The LGA package option is 100% hardware and software compatible
with designs using the NBA package. The PCB foot print, solder mask and solder profile are identical
for both packages. The LGA packaged devices have part numbers ending in –xM1(R), while the NBA
packaged parts have part numbers ending in –xM(R).
Reason for Change: LGA package option has been qualified.
Impact on Form, Fit, Function, Quality, Reliability: None, existing customers can continue to use
the NBA package, new customers can use the LGA package or the NBA package. Both packages have
identical footprints.
Product Identification:
LGA commercial
temp.
Si32260-C-FM1
Si32261-C-FM1
LGA industrial
temp.
Si32260-C-GM1
Si32261-C-GM1
NBA commercial
temp.
Si32260-C-FM
Si32261-C-FM
NBA industrial
temp.
Si32260-C-GM
Si32261-C-GM
Last Date of Unchanged Product: N/A
Qualification Samples: Available upon request. Please contact your local Silicon Laboratories sales
representative to order samples. A list of Silicon Laboratories sales representatives may be found at
www.silabs.com
W7206F1 Process Change Notice Form rev AA
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part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 1