S-25A010A Datasheet, PDF (1/35 Pages) Seiko Instruments Inc – Write protect function during the low power supply voltage

S-25A010A/020A/040A
www.sii-ic.com
© SII Semiconductor Corporation, 2008-2014
FOR AUTOMOTIVE 125°C OPERATION
SPI SERIAL E²PROM
Rev.5.2_01
This IC is a SPI serial E²PROM which operates under the high temperature, at high speed, with the wide range operation for
automotive components. This IC has the capacity of 1 K-bit, 2 K-bit, 4 K-bit and the organization of 128 words × 8-bit, 256
words × 8-bit, 512 words × 8-bit. Page write and Sequential read are available.
Caution Before using the product in automobile control unit or medical equipment, contact to SII Semiconductor
Corporation is indispensable.
 Features
 Packages
• Operating voltage range
Read:
2.5 V to 5.5 V
Write:
2.5 V to 5.5 V
• Operation frequency:
• Write time:
• SPI mode (0, 0) and (1, 1)
• Page write:
• Sequential read
• Write protect:
Protect area:
6.5 MHz max.
4.0 ms max.
16 bytes / page
Software, Hardware
25%, 50%, 100%
• Monitoring of a write memory state by the status register
• Function to prevent malfunction by monitoring clock pulse
• Write protect function during the low power supply voltage
• CMOS schmitt input ( CS , SCK, SI, WP , HOLD )
• Endurance^*1:
10⁶ cycle / word^*2 (Ta = +25°C)
5 × 10⁵ cycle / word^*2 (Ta = +125°C)
• Data retention:
100 years (Ta = +25°C)
50 years (Ta = +125°C)
• Memory capacity
S-25A010A:
1 K-bit
S-25A020A:
2 K-bit
S-25A040A:
4 K-bit
• Initial delivery state:
FFh, BP1 = 0, BP0 = 0
• Burn-in specification:
Wafer level burn-in
• Operation temperature range: Ta = −40°C to +125°C
• Lead-free (Sn 100%), halogen-free^*3
• AEC-Q100 qualified^*4
*1. Refer to " Endurance" for details.
*2. For each address (Word: 8-bit)
*3. Refer to " Product Name Structure" for details.
*4. Contact our sales office for details.
• 8-Pin SOP (JEDEC)
5
8
4
1
(5.0 × 6.0 × t1.75 mm)
• 8-Pin TSSOP
5
8
4
1
(3.0 × 6.4 × t1.1 mm)
• TMSOP-8
5
8
4
1
(2.9 × 4.0 × t0.8 mm)
Remark Refer to "3. Product name list" in " Product Name Structure" for details of package and product.
1