LAE675 Datasheet, PDF (6/7 Pages) Siemens Semiconductor Group – Power TOPLED Hyper-Bright LED

Maßzeichnung
(Maße in mm, wenn nicht anders angegeben)
Package Outlines (Dimensions in mm, unless otherwise specified)
3.0
2.6
2.3
2.1
0.8
0.6
AC
CC
package
marking
A: Anode
C: Cathode
2.1
1.7
0.9
0.7
0.1 typ
0.6
0.18
0.4
0.12
LA E675
Empfehlung Lötpaddesign Infrarot/Vapor-Phase Reflow-Lötung
Recommended Pad
Infrared Vapor-Phase Reflow-Soldering
2.6
1.1
3.3
3.3
0.4
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
Semiconductor Group
Lötstoplack
solder resist
Cu Fläche / Cu-area
= 12 mm² per pad
6
1998-11-05