BTS728L2 Datasheet, PDF (3/14 Pages) Infineon Technologies AG – Smart High-Side Power Switch Two Channels: 2 x 60mΩ Status Feedback

BTS 728 L2
Maximum Ratings at T_j = 25°C unless otherwise specified
Parameter
Symbol
Values Unit
Supply voltage (overvoltage protection see page 4)
Supply voltage for full short circuit protection
T_j,start = -40 ...+150°C
Load current (Short-circuit current, see page 5)
Load dump protection¹⁾ V_LoadDump = V_A + V_s, V_A = 13.5 V
R_I²⁾ = 2 Ω, t_d = 200 ms; IN = low or high,
each channel loaded with R_L = 8.0 Ω,
Operating temperature range
Storage temperature range
Power dissipation (DC)⁴⁾
T_a = 25°C:
(all channels active)
T_a = 85°C:
Maximal switchable inductance, single pulse
V_bb = 12V, T_j,start = 150°C⁴⁾,
I_L = 4.0 A, E_AS = 220 mJ, 0 Ω
one channel:
I_L = 6.0 A, E_AS = 540 mJ, 0 Ω two parallel channels:
see diagrams on page 9
Electrostatic discharge capability (ESD)
IN:
(Human Body Model)
ST:
out to all other pins shorted:
acc. MIL-STD883D, method 3015.7 and ESD assn. std. S5.1-1993
R=1.5kΩ; C=100pF
Input voltage (DC)
Current through input pin (DC)
Current through status pin (DC)
see internal circuit diagram page 8
V_bb
V_bb
I_L
V_{Load dump3}⁾
T_j
T_stg
P_tot
Z_L
V_ESD
V_IN
I_IN
I_ST
43 V
24 V
self-limited A
60 V
-40 ...+150 °C
-55 ...+150
3.7 W
1.9
19.9 mH
22.3
1.0 kV
4.0
8.0
-10 ... +16 V
±2.0 mA
±5.0
Thermal Characteristics
Parameter and Conditions
Symbol
Thermal resistance
junction - soldering point^4),5)
junction - ambient⁴⁾
each channel:
one channel active:
all channels active:
R_thjs
R_thja
Values
Unit
min typ Max
--
-- 13.5 K/W
-- 41
--
-- 34
--
1) _{Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins (a 150Ω}
resistor for the GND connection is recommended.
2) _{RI = internal resistance of the load dump test pulse generator}
3) _{VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839}
4) _{Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm}2 _{(one layer, 70µm thick) copper area for Vbb}
connection. PCB is vertical without blown air. See page 14
5) _{Soldering point: upper side of solder edge of device pin 15. See page 14}
Semiconductor Group
Page 3
1999-Mar-23