BSP550 Datasheet, PDF (1/7 Pages) Siemens Semiconductor Group – MiniPROFET (High-side switch Short-circuit protection Input protection Overtemperature protection with hysteresis)

MiniPROFET
• High-side switch
• Short-circuit protection
• Input protection
• Overtemperature protection with hysteresis
• Overload protection
• Overvoltage protection
• Switching inductive load
• Clamp of negative output voltage with inductive loads
• Undervoltage shutdown
• Maximum current internally limited
• Electrostatic discharge (ESD) protection
• Reverse battery protection¹⁾
Package: SOT 223
Type
BSP 550
Ordering code
Q67000-S311
Mini PROFET® BSP 550
4
3
2
1
Pins
1
2
3
4
OUT GND
IN
V_bb
Maximum Ratings
Parameter
Supply voltage range
Load current
self-limited
Maximum input voltage²⁾
Maximum input current
Inductive load switch-off energy dissipation
single pulse
I_L = 1.0A , T_A = 85°C
Operating temperature range
Storage temperature range
Max. power dissipation (DC)³⁾
T_A = 25 °C
Electrostatic discharge capability (ESD)⁴⁾
Symbol
V_bb
I_L
V_IN
I_IN
E_AS
T_j
T_stg
P_tot
V_ESD
Thermal resistance
chip - soldering point: R_thJS
chip - ambient³⁾ R_thJA
Values
-0.3...48
I_L(SC)
-5.0...V_bb
±5
0.3
Unit
V
A
V
mA
J
-40 ...+125 °C
-55 ...+150
1.4
W
±1 kV
7 K/W
70
ESD-
Diode
3 IN ^Rin
Voltage
source
V _Logic
Voltage
sensor
Overvoltage Current
Gate
protection
limit protection
+ Vbb ₄
Charge pump
Level shifter
Rectifier
Limit for
unclamped
ind. loads
OUT
1
Temperature
sensor
ESD
Logic
Load
GND
2
Signal GND
MINI-PROFET
Load GND
1) _{With resistor RGND=150 Ω in GND connection, resistor in series with IN connections reverse load current}
limited by connected load.
2)
3)
4)
At V_IN > V_bb, the input current is not allowed to exceed
BSP 550 on epoxy pcb 40 mm x 40 mm x 1.5 mm with
HBM according to MIL-STD 883D, Methode 3015.7
±5 mA.
6 cm2 copper
area
for
V_bb
connection
Semiconductor Group
1
06.96