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BSM50GD60DN2 Datasheet, PDF (1/9 Pages) Siemens Semiconductor Group – IGBT Power Module (Power module 3-phase full-bridge Including fast free-wheel diodes) | |||
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IGBT Power Module
BSM 50 GD 60 DN2
⢠Power module
⢠3-phase full-bridge
⢠Including fast free-wheel diodes
⢠Package with insulated metal base plate
Type
BSM 50 GD 60 DN2
VCE IC
600V 50A
Maximum Ratings
Parameter
Collector-emitter voltage
Collector-gate voltage
RGE = 20 kâ¦
Gate-emitter voltage
DC collector current
TC = 40 °C
Pulsed collector current, tp = 1 ms
TC = 40 °C
Power dissipation per IGBT
TC = 25 °C
Chip temperature
Storage temperature
Thermal resistance, chip case
Diode thermal resistance, chip case
Insulation test voltage, t = 1min.
Creepage distance
Clearance
DIN humidity category, DIN 40 040
IEC climatic category, DIN IEC 68-1
Package
ECONOPACK 2K
Symbol
VCE
VCGR
VGE
IC
ICpuls
Ptot
Tj
Tstg
RthJC
RthJCD
Vis
-
-
-
-
Ordering Code
C67076-A2515-A67
Values
Unit
600
V
600
± 20
A
50
100
W
200
+ 150
°C
-55 ... + 150
⤠0.6
K/W
⤠1.5
2500
Vac
16
mm
11
F
sec
55 / 150 / 56
Semiconductor Group
1
Jan-10-1997
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