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MBS210_17 Datasheet, PDF (1/2 Pages) Shunye Enterprise – SINGLE PHASE AMP SURFACE MOUNT BRIDGE RECTIFIER 2.0 SCHOTTKY
MBS22 THRU MBS225
SINGLE PHASE 2.0 AMP SURFACE MOUNT SCHOTTKY BRIDGE RECTIFIER
Features
· Schottky Brrier Chip
· Low Power Loss,High Efficiency
· Ideally Suited for Automatic Assembly
· Surge Overload Rating to 50A Peak
· Plastic Case Material has UL Flammability
  C lassific a tionR ating 94V-0                         
Mechanical Data
· Case: MB-S, molded plastic
· Terminals: plated leads solderable per
MIL-STD-202, Method 208
· Polarity: as marked on case
· Mounting position: Any
· Marking: type number
· Lead Free: For RoHS / Lead Free Version,
0.043(1.1)
0.023(0.6)
MBS
-+
~~
0.028(0.7)
0.020(0.5)
צ㾦
e
0.161(4.1)
0.142(3.6)
MAX.
0.067(1.7)
0.051(1.3)
0.195(4.95)
0.177(4.5)
0.106(2.7)
0.090(2.3)
dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characteristics @TA=25°C unless otherwise specified
Single Phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
TYPE NUMBER
Peak Repetitive Reverse Voltage
RMS Reverse Voltage
DC Blocking Voltage
SYMBOL
MBS MBS MBS
22 23 24
MBS
245
MBS MBS MBS
25 26 28
MBS
210
MBS
215
MBS
220
MBS
225S
UNITS
VRRM 20 30 40 45 50 60 80 100 150 200 250
VR(RMS) 14 21 28 31 35 42 56 70 105 140 175 V
VDC 20 30 40 45 50 60 80 100 150 200 250
Average Rectified Output Current ( Note1) @TC= 100°C IF(AV)
2.0
A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
(JEDEC Method)
I2t Rating for Fusing (t < 8.3ms)
Forward Voltage per element
Peak Reverse Current
At Rated DC Blocking Voltage
@IF =2.0A
@TA = 25°C
@TA = 100°C
Typical Junction Capacitance per leg
IFSM
I2t
VFM
IRM
Cj
0.55
0.1
10
50
10.375
0.7
0.84
28
0.90
0.05
5
A
A2s
0.92 V
mA
pF
Typical Thermal Resistance per leg ( Note2)
Operating junction temperature range
Operating and Storage Temperature Range
RθJL
TJ
TSTG
16
-55 to +150
-55 to +150
°C/W
°C
°C
Note:
1. Mounted on aluminum substrate PC board with 1.3mm2 solder pad.
2. Thermal REsistance From Junction to LEAD
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