HDVF45A1DC Datasheet, PDF (6/9 Pages) Shoulder Electronics Limited. – SAW FILTER

SAW FILTER
HDVF45A1Dc SIP5Dc
Thermal
shock
Resistance to
Soldering
heat
for 96±4h. Then it shall be subjected to standard
atmospheric conditions for 1h, after which
measurement shall be made within 1h.
The specimen shall be subjected to 8 continuous
cycles each as shown below. Then it shall be
subjected to standard atmospheric conditions for
1h, after which measurement shall be made
within 1h.
Temperature
Duration
1
+25 ℃=>-40 ℃ 0.5h
2
-40 ℃
4h
3
-40 ℃=>+85 ℃ 2h
4
+85 ℃
4h
5
+85 ℃=>+25 ℃ 0.5h
6
+25 ℃
1h
Reflow soldering method
Peak: 255 ±5 ℃, 220 ±5 ℃, 40s
At electrode temperature of the specimen.
shall be no
excessive change in
appearance.
Solder ability
The specimen shall be passed through the reflow
furnace with the condition shown in the above
profile for 1 time.
The specimen shall be stored at standard
atmospheric conditions for 1h, after which the
measurement shall be made. Test board shall be
1.6 mm thick. Base material shall be glass fabric
base epoxy resin.
Immerse the pins melt solder at 260℃+5/-0℃
for 5 sec.
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More then 95% of
total area of the
pins should be
covered with solder
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