HDR315M2S6 Datasheet, PDF (5/8 Pages) Shoulder Electronics Limited. – This specification shall cover the characteristics of 1-port SAW resonator with R315M2 used for remote-control security.

SAW RESONATOR
HDR315M2 SMD-6
5. Environment Characteristic
5-1 Thermal Shock:
The components shall remain within the electrical specifications after being kept at the
condition of heat cycle conditions: TA=-40℃±3℃, TB=85℃±2℃, t1=t2=30min, switch
time≤3min& cycle time : 100 times, recovery time: 2h±0.5h.
5-2 Resistance to solder heat
Submerge the device terminals into the solder bath at 260℃ ±5℃ for 10±1 sec. Then release
the device into the room conditions for 4 hours. It shall meet the specifications in 2.2.
5-3 Solder ability
Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95%
area of the soldering pad must be covered with new solder. It shall meet the specifications in 2.2
5-4 The Temperature Storage:
5.3.1 High Temperature Storage: The components shall remain within the electrical
specifications after being kept at the 85℃±2℃for 96h±4h, recovery time : 2h±0.5h.
5.3.2 Low Temperature Storage: The components shall remain within the electrical
specifications after being kept at the –40℃±3℃for 96h±4h, recovery time : 2h±0.5h.
5-5 Humidity test:
The components shall remain within the electrical specifications after being kept at the
condition of ambient temperature 60℃±2℃, and 90~96% RH for 96h±4h.
5-6 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1m for 3 times. The
resonator shall fulfill the specifications in 2.2.
5-7 Vibration
Subject the device to the vibration for 2 hour each in X, Y and Z axes with the amplitude of
1.5 mm at 10 to 55 Hz. The resonator shall fulfill the specifications in 2.2.
6. Remark
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of the
component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please avoid
ultrasonic cleaning
6.3 Soldering
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