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IRFR9120N Datasheet, PDF (2/10 Pages) Kersemi Electronic Co., Ltd. – Ultra Low On-Resistance
IRFR/U9120N
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
V(BR)DSS Drain-to-Source Breakdown Voltage
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
Gate Threshold Voltage
gfs
Forward Transconductance
IDSS
Drain-to-Source Leakage Current
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
LD
Internal Drain Inductance
LS
Internal Source Inductance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Min. Typ. Max. Units
Conditions
-100 ––– ––– V VGS = 0V, ID = -250µA
––– -0.11 ––– V/°C Reference to 25°C, ID = -1mA
––– ––– 0.48 Ω VGS = -10V, ID = -3.9A „
-2.0 ––– -4.0 V VDS = VGS, ID = -250µA
1.4 ––– ––– S VDS = -50V, ID = -4.0A†
––– ––– -25 µA VDS = -100V, VGS = 0V
––– ––– -250
VDS = -80V, VGS = 0V, TJ = 150°C
––– ––– 100 nA VGS = 20V
––– ––– -100
VGS = -20V
––– ––– 27
ID = -4.0A
––– ––– 5.0
––– ––– 15
nC VDS = -80V
VGS = -10V, See Fig. 6 and 13 „†
––– 14 –––
VDD = -50V
––– 47 ––– ns ID = -4.0A
––– 28 –––
RG = 12 Ω
––– 31 –––
RD =12 Ω, See Fig. 10 „†
Between lead,
D
––– 4.5 –––
6mm (0.25in.)
nH
from package
G
––– 7.5 –––
and center of die contact…
S
––– 350 –––
VGS = 0V
––– 110 ––– pF VDS = -25V
––– 70 –––
ƒ = 1.0MHz, See Fig. 5†
Source-Drain Ratings and Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode) 
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
MOSFET symbol
D
––– ––– -6.6 A showing the
integral reverse
G
––– ––– -26
p-n junction diode.
S
––– ––– -1.6 V TJ = 25°C, IS = -3.9A, VGS = 0V „
––– 100 150 ns TJ = 25°C, IF = -4.0A
––– 420 630 nC di/dt = 100A/µs „†
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
‚ Starting TJ = 25°C, L = 13mH
RG = 25Ω, IAS = -3.9A. (See Figure 12)
ƒ ISD ≤ -4.0A, di/dt ≤ 300A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 150°C
„ Pulse width ≤ 300µs; duty cycle ≤ 2%.
…This is applied for I-PAK, LS of D-PAK is measured between
lead and center of die contact
† Uses IRF9520N data and test conditions.
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