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AON7401 Datasheet, PDF (2/5 Pages) Alpha & Omega Semiconductors – P-Channel Enhancement Mode Field Effect Transistor
AON7401
30V P-Channel MOSFET
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min Typ Max Units
STATIC PARAMETERS
BVDSS Drain-Source Breakdown Voltage
ID=-250µA, VGS=0V
-30
V
IDSS
Zero Gate Voltage Drain Current
VDS=-30V, VGS=0V
TJ=55°C
-1
µA
-5
IGSS
Gate-Body leakage current
VDS=0V, VGS= ±25V
±100 nA
VGS(th) Gate Threshold Voltage
VDS=VGS ID=-250µA
-1.7 -2.2 -3
V
ID(ON)
On state drain current
VGS=-10V, VDS=-5V
-80
A
RDS(ON) Static Drain-Source On-Resistance
VGS=-10V, ID=-9A
TJ=125°C
11
14
mΩ
16
19
VGS=-6V, ID=-7A
12.9 17 mΩ
gFS
Forward Transconductance
VDS=-5V, ID=-9A
27
S
VSD
Diode Forward Voltage
IS=-1A,VGS=0V
-0.7 -1
V
IS
Maximum Body-Diode Continuous Current
-25
A
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VDS=-15V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
2060 2600 pF
370
pF
295
pF
2.4 3.6
Ω
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
30
39
nC
Qgs
Gate Source Charge
VGS=-10V, VDS=-15V, ID=-9A
4.6
nC
Qgd
Gate Drain Charge
10
nC
tD(on)
Turn-On DelayTime
11
ns
tr
Turn-On Rise Time
VGS=-10V, VDS=-15V, RL=1.6Ω,
9.4
ns
tD(off)
Turn-Off DelayTime
RGEN=3Ω
24
ns
tf
Turn-Off Fall Time
12
ns
trr
Body Diode Reverse Recovery Time IF=-9A, dI/dt=500A/µs
14
18
ns
Qrr
Body Diode Reverse Recovery Charge IF=-9A, dI/dt=500A/µs
35
nC
A. The value of RqJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
Power dissipation PDSM is based on R qJA t ≤ 10s value and the maximum allowed junction temperature of 150°C. The value in any given
application depends on the user's specific board design, and the maximum temperature of 150°C may be used if the PCB allows it.
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initial TJ =25°C.
D. The RqJA is the sum of the thermal impedence from junction to case RqJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300ms pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming
a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
G. The maximum current rating is package limited.
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
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