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AON2400 Datasheet, PDF (2/5 Pages) Alpha & Omega Semiconductors – 8V N-Channel MOSFET
AON2400
8V N-Channel MOSFET
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol Parameter
Conditions
Min
STATIC PARAMETERS
BVDSS Drain-Source Breakdown Voltage
ID=250µA, VGS=0V
8
IDSS
Zero Gate Voltage Drain Current
VDS=8V, VGS=0V
TJ=55°C
IGSS
Gate-Body leakage current
VDS=0V, VGS=±5V
VGS(th) Gate Threshold Voltage
VDS=VGS, ID=250µA
ID(ON)
On state drain current
VGS=4.5V, VDS=5V
32
VGS=2.5V, ID=8A
TJ=125°C
RDS(ON) Static Drain-Source On-Resistance VGS=1.8V, ID=6A
VGS=1.5V, ID=5A
VGS=1.2V, ID=3A
gFS
Forward Transconductance
VDS=5V, ID=8A
VSD
Diode Forward Voltage
IS=1A,VGS=0V
IS
Maximum Body-Diode Continuous Current
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VDS=4V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
SWITCHING PARAMETERS
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
trr
Qrr
Total Gate Charge
Gate Source Charge
Gate Drain Charge
VGS=4.5V, VDS=4V, ID=8A
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
VGS=4.5V, VDS=4V, RL=0.5Ω,
RGEN=3Ω
Turn-Off Fall Time
Body Diode Reverse Recovery Time IF=8A, dI/dt=100A/µs
Body Diode Reverse Recovery Charge IF=8A, dI/dt=100A/µs
Typ Max Units
V
1
µA
5
±100 nA
0.46
V
A
8.5 11
mΩ
11
14
10
13 mΩ
11.5 16 mΩ
16
23 mΩ
100
S
0.53 1
V
4.5
A
1645
pF
470
pF
320
pF
1.6 3.2
Ω
16
nC
2
nC
2.8
nC
7
ns
25
ns
37
ns
13
ns
17
ns
9
nC
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C.
The Power dissipation PDSM is based on R θJA t ≤ 10s value and the maximum allowed junction temperature of 150°C. The value in any
given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initial TJ =25°C.
D. The RθJA is the sum of the thermal impedance from junction to case RθJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink,
assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
G. The maximum current rating is package limited.
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.
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