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AO4486 Datasheet, PDF (2/6 Pages) Alpha & Omega Semiconductors – 100V N-Channel MOSFET
AO4486
100V N-Channel MOSFET
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min Typ Max Units
STATIC PARAMETERS
BVDSS Drain-Source Breakdown Voltage
ID=250µA, VGS=0V
100
V
IDSS
Zero Gate Voltage Drain Current
VDS=100V, VGS=0V
TJ=55°C
1
µA
5
IGSS
Gate-Body leakage current
VDS=0V, VGS= ±20V
±100 nA
VGS(th) Gate Threshold Voltage
VDS=VGS ID=250µA
1.6 2.2 2.7
V
ID(ON)
On state drain current
VGS=10V, VDS=5V
31
A
RDS(ON) Static Drain-Source On-Resistance
VGS=10V, ID=3A
TJ=125°C
62.5 79
mΩ
121 151
VGS=4.5V, ID=3A
68.5 90 mΩ
gFS
Forward Transconductance
VDS=5V, ID=3A
20
S
VSD
Diode Forward Voltage
IS=1A,VGS=0V
0.74 1
V
IS
Maximum Body-Diode Continuous Current
3.5
A
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VDS=50V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
620 778 942 pF
38
55
81
pF
13
24
35
pF
0.7 1.45 2.2
Ω
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
13 16.3 20 nC
Qg(4.5V) Total Gate Charge
Qgs
Gate Source Charge
VGS=10V, VDS=50V, ID=3.0A
6.4 8.1 10 nC
2.2 2.8 3.4 nC
Qgd
Gate Drain Charge
2.4 4.1 5.8 nC
tD(on)
Turn-On DelayTime
6
ns
tr
Turn-On Rise Time
VGS=10V, VDS=50V, RL=16.7Ω,
2.5
ns
tD(off)
Turn-Off DelayTime
RGEN=3Ω
21
ns
tf
Turn-Off Fall Time
2.4
ns
trr
Body Diode Reverse Recovery Time IF=3A, dI/dt=500A/µs
14
21
28
ns
Qrr
Body Diode Reverse Recovery Charge IF=3A, dI/dt=500A/µs
65
94 123 nC
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2 FR-4 board with
2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
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