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MC6415 Datasheet, PDF (1/5 Pages) –
Freescale
P-Channel 20-V (D-S) MOSFET
These miniature surface mount MOSFETs utilize a
high cell density trench process to provide low
rDS(on) and to ensure minimal power loss and heat
dissipation. Typical applications are DC-DC
converters and power management in portable and
battery-powered products such as computers,
printers, PCMCIA cards, cellular and cordless
telephones.
•
Low rDS(on) provides higher efficiency and
extends battery life
• Low thermal impedance copper leadframe
TSOP-6 saves board space
• Fast switching speed
• High performance trench technology
AO6 41 5/ MC6 41 5
PRODUCT SUMMARY
VDS (V)
rDS(on) m(Ω)
90 @ VGS = -4.5V
-20 130 @ VGS = -2.5V
150 @ VGS = -1.8V
ID (A)
-2.9
-2.5
-2.3
1
6
2
5
3
4
ABSOLUTE MAXIMUM RATINGS (TA = 25 oC UNLESS OTHERWISE NOTED)
Parame te r
Symbol Maximum Units
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Currenta
Pulsed Drain Currentb
VDS
VGS
TA=25oC
TA=70oC
ID
IDM
-20
V
±12
-2.9
-2.4
A
±16
Continuous Source Current (Diode Conduction)a
IS
-1.0
A
Power Dissipationa
Operating Junction and Storage Temperature Range
TA=25oC
TA=70oC
PD
2.0
W
1.3
TJ, Tstg -55 to 150 oC
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta
t <= 5 sec
Symbol
RθJA
Maximum
62.5
110
Units
oC/W
oC/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
b. Pulse width limited by maximum junction temperature
1
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