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MC3409 Datasheet, PDF (1/6 Pages) –
FArneaelsocgale
Freescale
Freescale
ower
AO34A0M9/M23C13940P9
P - Channel Logic Level MOSFET
These miniature surface mount MOSFETs
utilize High Cell Density process. Low
rDS(on) assures minimal power loss and
conserves energy, making this device ideal
for use in power management circuitry.
Typical applications are voltage control
small signal switch, power management in
portable and battery-powered products
such as computer portable electronics and
other battery power application.
•
Low rDS(on) Provides Higher Efficiency and
Extends Battery Life
• Fast Switch
• Low Gate Charge
• Miniature SOT-23 Surface Mount Package
Saves Board Space
PRODUCT SUMMARY
VDS (V)
-30
rDS(on) (Ω)
0.20 @ VGS = -10 V
0.30 @ VGS = -4.5V
ID (A)
-2.1
-1.7
G
D
S
ABSOLUTE MAXIMUM RATINGS (TA = 25 oC UNLESS OTHERWISE NOTED)
Parame te r
Symbol Maximum Units
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Currenta
Pulsed Drain Currentb
Continuous Source Current (Diode Conduction)a
VDS
VGS
TA=25oC
TA=70oC
ID
IDM
IS
-30
V
±20
-2.1
-1.7
A
±10
-0.4
A
Power Dissipationa
Operating Junction and Storage Temperature Range
TA=25oC
TA=70oC
PD
1.25
W
0.8
TJ, Tstg -55 to 150 oC
THERMAL RESISTANCE RATINGS
Paramete r
Maximum Junction-to-Ambienta
t <= 5 sec
Steady-State
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
b. Pulse width limited by maximum junction temperature
Symbol
RT HJA
M aximum Units
250
oC/W
285
1
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