GP2W3120YP0F Datasheet, PDF (11/15 Pages) Sharp Electrionic Components – IrDA Compliant Transceiver Module 9.6 kb/s to 4 Mb/s (FIR) Low Profile Low Consumption Current

GP2W3120YP0F
■Soldering Method
1. In case of solder reflow
Please carry out only two times soldering at the temperature and the time within the temperature profile as shown
in the figure below. Reflow interval shall be within 3 days under conditions, 10 to 30℃, 70%RH or less.
MAX
260℃
200℃
MAX
165℃
1 to 5℃/s
1 to 5℃/s
25℃
MAX120s
MAX10s
MAX70s
2. Other precautions
An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin.
So keep the package temperature within that specified in Item 1. Also avoid immersing the resin part in the solder.
Even if within the temperature profile above, there is the possibility that the gold wire in package is broken
in case that the deformation of PCB gives the affection to lead pins. Please use after confirming the conditions fully
by actual solder reflow machine.
3. Soldering
・Soldering iron shall be less than 25W, and temperature of point of soldering iron shall use at 300℃or less.
・Soldering time shall be within 5s.
・Soldered product shall treat at normal temperature.
Sheet No.: E3-A00802EN
11