GL5ZS302BOS Datasheet, PDF (10/11 Pages) Sharp Electrionic Components – DEVICE SPECIFICATION FOR Light Emitting Diode

DG996029
MODEL No.
GL5ZS302BOS
7. Precautions for use
7 - 1. Lead forming method
Avoid forming a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be formed before soldering.
7 - 2. Notice of installation
7-Z-l installation on a PWB
Whenmounting an LEDlamp on a PWBdo not apply
physical stress to the lead pins.
l The lead pin pitch should match the PWBpin-hole
pitch:absolutely avoid widening or narrowing
the lead pins.
l Whenpositioning an LED lamp,basically employ
an LEDwith tie-bar cut or use a spacer.
7-Z-Z Whenan LED1 is mounteddirectly on a P W B
If the bottom face of an LED lamp is mounted
directly on single-sided PWBthe base of the
lead pins maybe subjected to physical stress
due to PWBwarp,cutting or clinching of lead
pins. Prior to use,be sure to check that no
disconnection inside of the resin or damage to
resin etc., is found. Whenan LED lamp is mounted
on a double-sided PWB,theheat during soldering
affects the resin;therefore.keep the LED lamp
more that 1.60~1afloat above the PWB.
7-Z-3 Installation using a holder
During an LEDlamp positioning,when a holder is
used,a holder should be designed not to subject
lead pins to any undue stress.
(Note)Pay attention to the thermal expansion coefficient
of the material used for the holder.Since the
holder e.xpandsand contracts due to preheat and
soldering heat, mechanical stress may be applied to
the lead pins, resulting in disconnection.
7-Z-4 Installation to the case
Do not fix part C with adhesives when fixed to the
case as shown in Figure.A hole of the case should
be designed not to subject the ins
to any undue stress.
Juni16/99
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Gooc