GP1S33 Datasheet, PDF (1/4 Pages) Sharp Electrionic Components – Subminiature, Reflow Soldering Type Photointerrupter

GP1S33
s Features
1. Ultra-compact package
2. PWB mounting type
3. High sensing accuracy ( Slit width : 0.3mm )
4. Applying to reflow soldering
Preheat : 160˚C within 120 seconds
Reflow : 200˚C within 60 seconds
( Peak : 240˚C )
s Applications
1. Floppy disk drives
2. Cameras
GP1S33
Subminiature, Reflow Soldering
Type Photointerrupter
s Outline Dimensions
(Unit : mm )
Internal connection diagram
4
3
5.0
1.5 2.0
Center of
light path
1
2
1 Anode
3 Emitter
2 Collector 4 Cathode
4.2
(0.3)
Slit width
(C0.8)
(C0.3)
3.8
1.0^{± 0.5 4 - 0.5}
g 2.5
Rest of gate
1
2
* Tolerance :± 0.2mm
* Burr's dimensions : 0.15MAX.
* Rest of gate : 0.3MAX.
* ( ) : Reference dimensions
* The dimensions indicated by g refer
to those measured from the lead base.
4
3
s Absolute Maximum Ratings
Input
Output
Parameter
Forward current
Reverse voltage
Power dissipation
Collector-emitter voltage
Emitter-collector voltage
Collector current
Collector power dissipation
Total power dissipation
Operating temperature
Storage temperature
*1_{Soldering temperature}
*1 For 3 seconds
Symbol
IF
VR
P
VCEO
VECO
IC
PC
P tot
T opr
T stg
T sol
(Ta = 25˚C )
Rating
Unit
50
mA
6
V
75
mW
35
V
6
V
20
mA
75
mW
100
mW
- 25 to + 85
˚C
- 40 to + 100
˚C
260
˚C
Soldering area
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data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”