SGM4891 Datasheet, PDF (8/11 Pages) SG Micro Corp – 1.2W Audio Power Amplifier

SGM4891
1.2W Audio Power Amplifier
APPLICATION NOTES
PCB Design Recommendations (Thermal Design Considerations)
Thermal Land
The TDFN-2×2-8L thermal land is a metal (normally copper) region centrally located under the package and on top of
the PCB. It has a rectangular or square shape and should match the dimensions of the exposed pad on the bottom of
the package (1:1 ratio).
For certain high power applications, the PCB land may be modified to a "dog bone" shape that enhances thermal
performance. The packages used with the "dog bone" lands will be a dual inline configuration (see Figure 1).
Top View
Figure 1. Dog Bone
Thermal Vias
Thermal vias are necessary. They conduct heat from the exposed pad of the package to the ground plane. The number
of vias is application specific and is dependent upon electrical requirements and power dissipation.
The via diameter should be 0.2mm to 0.33mm with 1oz. copper via barrel plating. It is important to plug the via to avoid
any solder wicking inside the via during the soldering process. The thermal vias can be tented with solder mask on the
top surface of the PCB. The solder mask diameter should be at least 75microns (or 3mils) larger than the via diameter.
The solder mask thickness should be the same across the entire PCB.
A package thermal performance may be improved by increasing the number of vias.
SG Micro Corp
www.sg-micro.com
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