SGM8521 Datasheet, PDF (3/14 Pages) SG Micro Corp – 150KHz, 4.7μA, Rail-to-Rail I/O CMOS Operational Amplifier

PACKAGE/ORDERING INFORMATION
MODEL
SGM8521
SGM8522
SGM8524
ORDER NUMBER
SGM8521XN5/TR
SGM8521XS/TR
SGM8522XS/TR
SGM8522XMS/TR
SGM8524XS/TR
SGM8524XS14
SGM8524XTS/TR
PACKAGE
DESCRIPTION
SOT23-5
SO-8
SO-8
MSOP-8
SO-16
SO-14
TSSOP-16
PACKAGE
OPTION
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 2500
Tape and Reel, 3000
Tape and Reel, 2500
Tube
Tape and Reel, 3000
MARKING
INFORMATION
8521
SGM8521XS
SGM8522XS
SGM8522XMS
SGM8524XS
SGM8524XS14
SGM8524XTS
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V+ to V- . . . . . . . . . . . . . . . . . . . . . 7.5 V
Common-Mode Input Voltage
. . . . . . . . . . . . . . . . . . . . (–VS) – 0.5 V to (+VS )+0.5V
Storage Temperature Range . . . . . . . . .–65℃ to +150℃
Junction Temperature . . . . . . . . . . . . . . . .. . . . . . . .160℃
Operating Temperature Range . . . . . . –55℃ to +150℃
Package Thermal Resistance @ TA = 25℃
SOT23-5, θJA.............................................................. 190℃/W
SO-8, θJA......................................................................125℃/W
MSOP-8, θJA.............................................................. 216℃/W
SO-16, θJA..................................................................... 82℃/W
TSSOP-16, θJA............................................................ 105℃/W
Lead Temperature Range (Soldering 10 sec)
.....................................................260℃
ESD Susceptibility
HBM................................................................................4000V
MM....................................................................................400V
NOTES
1. Stresses above those listed under Absolute Maximum
Ratings may cause permanent damage to the device. This is
a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
CAUTION
This integrated circuit can be damaged by ESD.
Shengbang Micro-electronics recommends that all
integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance
degradation to complete device failure. Precision
integrated circuits may be more susceptible to
damage because very small parametric changes could
cause the device not to meet its published
specifications.
３
SGM8521/8522/8524