SGM3140B Datasheet, PDF (3/14 Pages) SG Micro Corp – Charge Pump LED Driver

SGM3140B
PIN CONFIGURATION (TOP VIEW)
500mA Buck/Boost
Charge Pump LED Driver
PIN DESCRIPTION
VIN 1
C1 2
C2 3
FLASH 4
EN 5
GND
10 VOUT
9 PGND
8 SGND
7 FB
6 RSET
TDFN-3×3-10L
PIN
1
2
3
4
5
6
7
8
9
10
Exposed
Pad
NAME
VIN
C1
C2
FLASH
EN
RSET
FB
SGND
PGND
VOUT
GND
FUNCTION
Input Voltage for the Charge Pump. Decouple with 4.7μF or 10μF ceramic capacitor close
to the pins of the IC.
Positive Input for the External Flying Capacitor. Connect a ceramic 1μF capacitor close to
the pins of the IC.
Negative Input for the External Flying Capacitor. Connect a ceramic 1μF capacitor close to
the pins of the IC.
Logic Input to Toggle Operation between Flash and Torch Mode. In Torch mode FB is
regulated to the internal 47mV reference. In Flash mode FB reference voltage can be
adjusted by changing the resistor from RSET pin to ground. Choose the external current
sense resistor (R_SENSE) based on desired current in Torch mode and Flash mode.
Shutdown Control Input. Connect to VIN for normal operation. Connect to ground for
shutdown. For normal operation, suggest to connect to VIN only after the VIN has settled if
the VIN ramping up is slow.
RSET Pin. Connect a resistor from this pin to ground. When in Flash mode (FLASH =
High) this resistor sets the current regulation point according to the following:
V_FB = (1.26V/R_SET) × 10.2kΩ.
Feedback Input for the Current Control Loop. Connect directly to the current sense
resistor.
Internal Ground Pin. Control circuitry returns current to this pin.
Power Ground Pin. Flying capacitor current returns through this pin.
Charge Pump Output Voltage. Decouple with an external capacitor. At least 1μF is
recommended. If higher value capacitor is used, output ripple is smaller.
Exposed pad should be soldered to PCB board and connected to GND.
SG Micro Corp
3
www.sg-micro.com