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SGM9153 Datasheet, PDF (2/10 Pages) SG Micro Corp – High Speed, Low Voltage, Capless Video Driver
SGM9153
High Speed, Low Voltage
Capless Video Driver with LPF
PACKAGE/ORDERING INFORMATION
MODEL
SGM9153
PACKAGE
DESCRIPTION
MSOP-10
TDFN-3×3-10L
SPECIFIED
TEMPERATURE
RANGE
ORDERING
NUMBER
-40℃ to +125℃ SGM9153XMS10G/TR
-40℃ to +125℃ SGM9153XTD10G/TR
PACKAGE
MARKING
SGM9153
XMS10
XXXXX
SGM
9153D
XXXXX
PACKING
OPTION
Tape and Reel, 4000
Tape and Reel, 4000
NOTE: XXXXX = Date Code and Vendor Code.
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VCC....................................................... 5.0V
Junction Temperature .................................................. 150℃
Storage Temperature Range........................ -65℃ to +150℃
Lead Temperature (Soldering, 10s).............................. 260℃
ESD Susceptibility
HBM............................................................................ 6000V
MM................................................................................ 400V
VOUT Pin IEC 61000-4-2 Contact Discharge ............. 8000V
RECOMMENDED OPERATING CONDITIONS
Input Voltage Range .......................................... 2.5V to 4.0V
Operating Temperature Range .................... -40℃ to +125℃
OVERSTRESS CAUTION
Stresses beyond those listed may cause permanent damage
to the device. Functional operation of the device at these or
any other conditions beyond those indicated in the
operational section of the specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged by ESD if you don’t
pay attention to ESD protection. SGMICRO recommends that
all integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation
procedures can cause damage. ESD damage can range from
subtle performance degradation to complete device failure.
Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause
the device not to meet its published specifications.
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, specification or other related things if
necessary without notice at any time
SG Micro Corp
2
www.sg-micro.com