SGM8933 Datasheet, PDF (2/16 Pages) SG Micro Corp – Rail-to-Rail Output Operational Amplifiers

SGM8931/2/3/4
1.5MHz, Rail-to-Rail Output
Operational Amplifiers
PACKAGE/ORDERING INFORMATION
MODEL
SGM8931
SGM8932
SGM8933
SGM8934
ORDER NUMBER
SGM8931AYN5G/TR
SGM8931BYN5G/TR
SGM8931YC5G/TR
SGM8931YS8G/TR
SGM8931YMS8G/TR
SGM8932YMS8G/TR
SGM8932YS8G/TR
SGM8933YN6G/TR
SGM8933YS8G/TR
SGM8933YMS8G/TR
SGM8934YS14G/TR
SGM8934YTS14G/TR
PACKAGE
DESCRIPTION
SOT-23-5
SOT-23-5
SC70-5
SOIC-8
MSOP-8
MSOP-8
SOIC-8
SOT-23-6
SOIC-8
MSOP-8
SOIC-14
TSSOP-14
PACKAGE
OPTION
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 3000
MARKING
INFORMATION
SAAXX
SB1XX
SABXX
SGM8931YS8
SGM8931YMS8
SGM8932YMS8
SGM8932YS8
SA8XX
SGM8933YS8
SGM8933YMS8
SGM8934YS14
SGM8934YTS14
NOTE: Package marking is defined as the follow:
MARKING INFORMATION
SYY X X
Date code - Month ("A" = Jan. "B" = Feb. … "L" = Dec.)
Date code - Year ("A" = 2010, "B" = 2011 …)
Chip I.D.
For example: SAABA (2011, January)
ABSOLUTE MAXIMUM RATINGS
CAUTION
Supply Voltage, +V_S to -V_S......................................................6V
Common Mode Input Voltage.....................-0.1V to (+VS) - 1.3V
Storage Temperature Range..............................-65℃ to +150℃
Junction Temperature .......................................................150℃
Operating Temperature Range........................... -40℃ to +85℃
Lead Temperature (Soldering 10sec)
...........................................................................................260℃
ESD Susceptibility
HBM (SGM8931/2/4).........................................................8000V
HBM (SGM8933)...............................................................4000V
MM .....................................................................................400V
NOTE:
Stresses beyond those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. These
are stress ratings only, and functional operation of the device at
these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
This integrated circuit can be damaged by ESD if you don’t pay
attention to ESD protection. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation procedures
can cause damage. ESD damage can range from subtle
performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because
very small parametric changes could cause the device not to
meet its published specifications.
SGMICRO reserves the right to make any change in circuit
design, specification or other related things if necessary without
notice at any time. Please contact SGMICRO sales office to get
the latest datasheet.
SG Micro Corp
2
www.sg-micro.com