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SGM8542_15 Datasheet, PDF (2/17 Pages) SG Micro Corp – CMOS Operational Amplifiers | |||
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SGM8541/2/4
PACKAGE/ORDERING INFORMATION
MODEL
SGM8541
SGM8542
SGM8544
ORDER NUMBER
SGM8541XC5/TR
SGM8541XN5/TR
SGM8541XS/TR
SGM8542XS/TR
SGM8542XMS/TR
SGM8542XTS8G/TR
SGM8544XS14/TR
SGM8544XTS14/TR
PACKAGE
DESCRIPTION
SC70-5
SOT-23-5
SOIC-8
SOIC-8
MSOP-8
TSSOP-8
SOIC-14
TSSOP-14
1.1MHz, 46μA, Rail-to-Rail I/O
CMOS Operational Amplifiers
PACKAGE
OPTION
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 2500
Tape and Reel, 3000
Tape and Reel, 4000
Tape and Reel, 2500
Tape and Reel, 3000
MARKING
INFORMATION
8541
8541
SGM8541XS
SGM8542XS
SGM8542XMS
SGM8542XTS8
SGM8544XS14
SGM8544XTS14
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, +VS to -VS .....................................................6V
Input Common Mode Voltage
..........................................................(-VS) - 0.3V to (+VS) + 0.3V
Storage Temperature Range..............................-65â to +150â
Junction Temperature .......................................................150â
Operating Temperature Range ......................... -40â to +125â
Package Thermal Resistance @ TA = +25â
SC70-5, θJA................................................................... 333â/W
SOT-23-5, θJA............................................................... 190â/W
SOIC-8, θJA....................................................................125â/W
MSOP-8, θJA .................................................................216â/W
TSSOP-8, θJAâ¦â¦â¦â¦â¦â¦â¦â¦â¦â¦â¦â¦â¦â¦â¦â¦â¦â¦â¦â¦â¦â¦â¦â¦â¦â¦â¦175â/W
Lead Temperature (Soldering 10sec)................................260â
ESD Susceptibility
HBM..................................................................................4000V
MM......................................................................................400V
CAUTION
This integrated circuit can be damaged by ESD if you donât pay
attention to ESD protection. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation procedures
can cause damage. ESD damage can range from subtle
performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because
very small parametric changes could cause the device not to
meet its published specifications.
SGMICRO reserves the right to make any change in circuit
design, specification or other related things if necessary without
notice at any time. Please contact SGMICRO sales office to get
the latest datasheet.
NOTE:
Stresses beyond those listed under âAbsolute Maximum
Ratingsâ may cause permanent damage to the device. These
are stress ratings only, and functional operation of the device at
these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
SG Micro Corp
2
www.sg-micro.com
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