SGM8302 Datasheet, PDF (2/16 Pages) SG Micro Corp – Rail-to-Rail Output Amplifiers

SGM8301/2/4
PACKAGE/ORDERING INFORMATION
MODEL
SGM8301
SGM8302
SGM8304
ORDER NUMBER
SGM8301YS8G/TR
SGM8301YMS8G/TR
SGM8301YN5G/TR
SGM8302YS8G/TR
SGM8302YMS8G/TR
SGM8304YS14G/TR
SGM8304YTS14G/TR
PACKAGE
DESCRIPTION
SOIC-8
MSOP-8
SOT-23-5
SOIC-8
MSOP-8
SOIC-14
TSSOP-14
NOTE: Package marking is defined as the follow:
MARKING INFORMATION
SA6 X X
Date code - Month ("A" = Jan. "B" = Feb. … "L" = Dec.)
Date code - Year ("A" = 2010, "B" = 2011 …)
Chip I.D.
For example: SA6CA (2012, January)
100MHz, High Voltage,
Rail-to-Rail Output Amplifiers
PACKAGE
OPTION
Tape and Reel, 2500
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 3000
MARKING
INFORMATION
SGM8301YS8
SGM8301YMS8
SA6XX
SGM8302YS8
SGM8302YMS8
SGM8304YS14
SGM8304YTS14
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (+V_S to -V_S) ……........................-0.3V to +13.2V
IN_+, IN_-, OUT_ …..........................(-V_S - 0.3V) to (+V_S + 0.3V)
Differentia Input Voltage ....................................................±2.5V
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature..................................................... +150°C
Storage Temperature Range ............................-65°C to +150°C
Lead Temperature (Soldering, 10s) ................................+260°C
ESD Susceptibility
HBM (SGM8301/4)............................................................3000V
HBM (SGM8302)...............................................................2000V
MM......................................................................................250V
NOTE:
Stresses beyond those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. These
are stress ratings only, and functional operation of the device at
these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
CAUTION
This integrated circuit can be damaged by ESD if you don’t pay
attention to ESD protection. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation procedures
can cause damage. ESD damage can range from subtle
performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because
very small parametric changes could cause the device not to
meet its published specifications.
SGMICRO reserves the right to make any change in circuit
design, specification or other related things if necessary without
notice at any time. Please contact SGMICRO sales office to get
the latest datasheet.
SG Micro Corp
2
www.sg-micro.com