D15XB60H Datasheet, PDF (1/4 Pages) Shindengen Electric Mfg.Co.Ltd – Bridge Diode

Bridge Diode
D15XB60H
600V 15A
特長
• 薄型 SIP パッケージ
• UL E142422
• 大電流容量
• 高耐圧・高 IFSM
• 高放熱伝導性
Feature
• Thin-SIP
• UL E142422
• Large Io
• High Voltage・Large IFSM
• High Thermal Radiation
シングルインライン型
Single In-line Package
■外観図　OUTLINE
Package：5S
Unit : mm
Weight : 7.1g（typ.）
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D15XB 60H 0264


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外形図については新電元 Web サイト又は〈半導体製品一覧表〉をご参照下
さい。捺印表示については捺印仕様をご確認下さい。
For details of outline dimensions, refer to our web site or the Semiconductor
Short Form Catalog. As for the marking, refer to the specification “Marking,
Terminal Connection.”
■_˙定_ఆ格_֨表_ද　
R_RA_AT_TIN_ING_GS_S
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Absolute Maximum Ratingsʢࢦఆͷͳ͍৔߹
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Item

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Symbol _Conditions
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Type
No.
D15XB60H
อଘԹ౓

Storage Temperature
઀߹෦Թ౓

Operation Junction Temperature
ͤΜ಄ిٯѹ

Maximum Reverse Voltage
ग़ྗిྲྀ

Average Rectified Forward Current
ͤΜ಄αʔδॱిྲྀ

Peak Surge Forward Current
ిྲྀೋ৐࣌ؒੵ

Current Squared Time
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Dielectric Strength
కΊ෇͚τϧΫ

Mounting Torque
5TUH

5K

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50Hz sine wave,
Resistance load
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With heatsink
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Without heatsink
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5K  ˆ

50Hz sine wave, Non-repetitive 1cycle peak value, Tj=25ˆ

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7E
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Terminals to Case, AC 1 minute
503

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ʢRecommended torque : 0.5 Nɾmʣ

5D  ˆ

5B  ˆ

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Unit
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Forward Voltage

ྲྀిٯ
Reverse Current
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Thermal Resistance
7'

*3

ВKD

ВKl
ВKB

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ύϧεଌఆɼ̍ૉࢠ౰ͨΓͷ֨ن஋
Pulse measurement, per diode
73

73.

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Pulse measurement, per diode
઀߹෦ɾέʔεؒɼϑΟϯ෇͖

Junction to Case, With heatsink
઀߹෦ɾϦʔυؒɼϑΟϯͳ͠

Junction to Lead, Without heatsink
઀߹෦ɾपғؒɼϑΟϯͳ͠

Junction to Ambient, Without heatsink
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