YGFR411-H Datasheet, PDF (9/13 Pages) Seoul Semiconductor – Small size suitable for compact appliances

7. Outline Dimension
1.5
24
Marking
(0.18)
Resin
㎜ Tolerance ± 0.1, Unit :
0.2
PCB
13
0.2
0.5
0.6
0.8
Cathode
24
YG
FR
13
Anode
0.2
1.8
[ Recommended Solder Pattern]
8. Material
Item
Substrate Chip (YG/FR)
Material BT-Resin PCB
AlInGaP
wire
Gold
Encapsulate Electrode
Epoxy
Au Plated
Rev. 03
January 2012
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서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)