YG202 Datasheet, PDF (9/13 Pages) Seoul Semiconductor – Surface-mounted chip LED device

7. Outline Dimension
㎜ Tolerance ± 0.1, Unit :
8. Material
Item
Substrate
Material BT-Resin PCB
chip
GaP
wire
Gold
Encapsulate Electrode
Epoxy
Au Plated
Rev. 01
January 2012
WWW.SEOULSEMICON.COM
서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)